e3511 Single-wafer Plasma Asher

Features

  • True downstream mw plasma process uses a heated platen
    with temp up to 300 deg for extreme low damage Photoresist removal or light etch
  • Process assisted with 1kw heat lamp for better uniformity and ashrate.  Solid State lamp controller eliminates calibration requirement.
  • Power supply system with DC-DC power supplies for clean power
  • Wafer cooling station with touch wafer sensor, works with substrates, glass etc.
  • Advanced Hine Hatm-5 pick and place robot
  • Gerling GL139 1.2kw microwave generator
  • Mititoyo 3 stub mw tuning
  • 6 pole mw applicator
  • Automatic photoemission end-point detection

Gallery