IDX Flexware is extremely flexible and ideal for process control, yield, productivity, uptime and maintenance. IDX is an open-architecture platform and is outstanding for both process flexibility and maintenance productivity.
IDX Flexware
ESI control with IDX Flexware
- Versatile, Flexible & Configurable
- Improved Performance and Yield
- Field Proven Performance
- SECS/GEM Compliant
- Intuitive Graphical User Interface
- Embedded Quad-core Intel® Atom PC with Slice type I/O*
- Flash drive data storage & USB Backup for recipes/data
- 17” Touchscreen
- Built-in watchdog timer for safe operation
- LED status of power and Digital I/O
* Optional
System Specifications
Process
Gas Flows O2=1000 –4000 sccm
N2/H2 = 100-1000 sccm
N2 –100 –500 scc
Pressure 0.5-> 5.0 torr
Platen Temperature 100°–300°C
μ-wave Power 0-1200 watt at 2.45 GHz
Lamp Utilization 0-100% (1000 watts)
Throughput 1.2 μmblanket soft-baked resist ashed to end point
except for deccums≤ 300Å
Descum/S.T. 45 -60 WPH
Baked Photoresist 45 -60 WPH
Implanted & Damaged Photoresist 25 -55 WPH
Uniformity Sigma, ashed to 50% of ≥ 1.2 μm
With in Wafer 2% -5%
Wafer to Wafer 2% -4%
Ash Rate < 200Å -≥3.5. μm./min.
System Matching 2% -5% (I sigma)
Mobile Ion Concentration IEI0/cm2 –IEII/cm2
CV Shift ≤0.1 volt
Particle <0.02/cm2, size of 0.2 μm
Reliability
- MTBF ≥168 hr.
- MTBA ≥ 36 hr.
- MTTR ≤ 3 hr. for 80% of all downs
- MTTA <5 min.
- UPTIME 89 –95% (SEMI EI0-92 STD)
General Information
- Substrate size 4 –8 inch 100-200 mm
- Footprint 30” 762 mm) W x 38” (965mm) D x 58” (1473mm) H
- Electrical 200-240 VAC. 2 Phase, 50/60 Hz,WYE configuration, 30A Breaker
- Typical Process Gases O2, N2/H2, N2 –regulated 18 –23 PSIG
Three Gas Configuration
- Gas1 4L O2
- Gas2 500 sccm N2 or N2O
- Gas3 2L N2or N2/4%H2
e3510 Upgrade Kit
- Available as PLUG AND PLAY UPGRADE TO ANY GASONICS L3500 SERIES TOOL